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  • LPKF Protolaser S4 PCB prototyping etching machine - specialized in the structuring of laminated printed circuit boards.
  • LPKF Protolaser S4 PCB Prototyping Machine - processes galvanic, through-plated boards with inhomogeneities up to 6μm thick
  • LPKF Protolaser S4 PCB Etching Prototyping Machine - Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4.
  • LPKF Protolaser S4 PCB prototyping machine - compact laser system produces precise, fine structures for demanding PCBs in a very short time - as single pieces or small series, without masks or tools
  • LPKF Protolaser S4 PCB Etching Prototyping Machine - processes plated-through boards with up to 6 μm strong inhomogeneities
  • LPKF Protolaser S4 PCB prototyping etching machine - specialized in the structuring of laminated printed circuit boards.
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LPKF

LPKF ProtoLaser S4 - PCB Etching Machine

LPKF ProtoLaser S4 - Intuitive and efficient prototyping

  • Benchmark for circuit board processing
  • Laser wavelength of 532 nm (green)
  • Simple, fast, precise
  • Any layout, without etching chemicals
  • Intuitive CircuitPro system software
Features and Benefits

Circuit Board Prototyping With the Laser

In PCB prototyping, laser technology has a number of advantages over conventional methods: Speed, precision, flexibility and economy.

LPKF ProtoLaser S4 is specialized in the structuring of laminated printed circuit boards.

Integrated economic efficiency

ProtoLaser S4 is a valuable tool in the electronics laboratory. The compact laser system produces precise, fine structures for demanding PCBs in a very short time - as single pieces or small series, without masks or tools. Using a special process, LPKF ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. ProtoLaser S4 also delivers excellent results on special materials for RF applications.

Large process window

The laser wavelength used opens up additional areas of application. The green laser (wavelength 532 nm) reduces the sensitivity to burns of the carrier substrate. LPKF ProtoLaser S4 also processes plated-through boards with up to 6 μm strong inhomogeneities. In addition, LPKF ProtoLaser S4 can economically cut and drill rigid or flexible substrates up to a thickness of 0.8 mm. Larger substrate thicknesses require more time.

Vision System

LPKF ProtoLaser S4 has integrated high-resolution camera quickly and accurately detects register marks or conductor structures on the board.

Software in a package

The intuitive CAM software LPKF CircuitPro is pre-installed on the integrated computer. It optimizes CAD data for the laser process and offers comprehensive access to the process parameters. An extensive parameter library for many common and exotic materials supports the operator in his own projects.

Modern design for the laboratory

LPKF ProtoLaser S4 packs smart solutions for operation and maintenance. The system fits on rollers through any laboratory door and makes no further demands on the laboratory apart from compressed air.

 

    Download LPKF ProtoLaser S4 Brochure

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