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  • LPKF MicroCut 6080 actual unit - front view
  • LPKF MicroCut 6080 - perfect water stencils with UniTense cutting technology
  • LPKF Microcut 6080 - 33,000 holes per hour (10 μm - 125 μm)
  • LPKF MicroCut, 6080 full specification - spec card
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LPKF MicroCut 6080 - Laser Stencil Cutting

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New Benchmark for Small Apertures - LPKF MicroCut 6080

Based on the proven StencilLaser G 6080 machine base, LPKF MicroCut 6080 offers unique advantages for users, who pay special attention to very small print.

With latest positioning and cutting technology specially tailored to the needs of small aperture applications make it possible to cut exact apertures as small as 18 µm on the laser entry side and 10 µm on the exit side e. g. on 30-µm-thick stainless steel foil.

Simple programming and parameter finding make it easy to overcome previously existing process limits to meet increasing market requirements.

LPKF MicroCut 6080 - The perfect solution for increasing market requirements:

  •  Wafer stencils
  •  Flux stencils
  •  Filter applications
  •  High precision, high yield


Please contact us here for a discussion.

We would be glad to hear more about your project!

Download LPKF MicroCut 6080 Brochure