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  • LPKF MicroCut 6080 actual unit - front view
  • LPKF MicroCut 6080 - perfect water stencils with UniTense cutting technology
  • LPKF Microcut 6080 - 33,000 holes per hour (10 μm - 125 μm)
  • LPKF MicroCut, 6080 full specification - spec card
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LPKF MicroCut 6080 - Laser Stencil Cutting

LPKF MicroCut 6080 - New Benchmark for Small Apertures

Based on the proven StencilLaser G 6080 machine base, LPKF MicroCut 6080 offers unique advantages for users who pay special attention to very small print.

With the latest positioning and cutting technology specially tailored to the needs of small aperture applications, it is possible to cut exact apertures as small as 18 µm on the laser entry side and 10 µm on the exit side e. g. on 30-µm-thick stainless steel foil.

Simple programming and parameter finding makes it easy to overcome existing process limits to meet increasing market requirements.


  •  Wafer stencils
  •  Flux stencils
  •  Filter applications
  •  High precision, high yield

Download LPKF MicroCut 6080 Brochure

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