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  • LPKF MicroLine 2820 P actual unit - front view
  • LPKF MicroLine 2820 P complies with 21 CFR 1040.10 and 1040.11
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  • LPKF MicroLine 2820 P close up view
  • LPKF MicroLine 2820 P spec card - full specifications
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LPKF Microline 2000 (2820 P) [DEMO UNIT] - Laser PCB Depaneling

LPKF MicroLine 2000 Systems (2820 P) - DEMO UNIT.  Laser Working Hours: 2162hrs. 

Made in Germany | 15 Watt Laser Source 

Features and Benefits

Supreme Cutting-Edge Technology

LPKF UV laser cutting system swiftly, cleanly, and accurately process very complicated tasks on printed circuit boards (PCBs). Available in different configurations, customizable for cutting populated and unpopulated rigid PCBs, also flex circuits and cover layers.

Absence of: Stress, Burrs, Particles

LPKF MicroLine 2000 systems uses advanced laser technology and mechanical engineering for precision cutting and separating of all types of PCBs (rigid, rigid-flex and flexible) and cover layers.

The MicroLine 2000’s UV laser source eases through cutting complex contours. PCB layout software makes importing of cutting data simple. Result of laser cutting shows no burrs or particles, furthermore materials or components are not mechanically stress.

Just the edge of material will be affected by heat, no effect on rest of body.

The exhaust system neatly removes all particles from laser cut.

  • Precision cutting of complex contours
  • Working area of up to 350 mm x 350 mm (13.8” x 13.8”)
  • Low energy and space requirements
  • Easy to operate
  • UV & Green laser available - up to 36W
  • Standalone & integrable version available

For better production depaneling and PCB processing, LPKF MicroLine 2000 systems are your best choice. Laser cutting has always been a cost efficient choice, where lesser consumables needed compared with mechanical cutting, lower energy consumption and compact design needing minimal physical space. Fixturing is also simple and economically designed.

Perfect Integration in Production Lines

LPKF MicroLine 2000 features integrated feed conveyors and SMEMA-compatible interfaces, This allows for transportation of the applications through the machine.

Laser Power and laser sources Options

There're different laser powers and 2 laser sources – UV laser and Green laser. Output power needed can be selected based on the material, cut quality, cycle time and cost. LPKF MicroLine 2000 system's application spectrum ranges from processing dielectric materials to flexible, flex-rigid and rigid boards. 

Integrated Vision System

Vision system built-in aligns to programmed fiducial and alignment points. Plenty of fiducial options and edge detection of routed areas to opt for. When operate with high-speed table, processing time is cut short significantly.

Higher Flexibility in Production Changes

UV Laser cutting technology used by LPKF MicroLine 2000 systems provides more freedom in production, from planning to prototypes and manufacturing of circuit board layout. 

LPKF CircuitMaster allows direct import of files from any design software and storing projects, accessible by production floor. LPKF CircuitMaster provides user management which customize access and permission levels to different personnel. 

Traceability Function Package

LPKF MicroLine 2000 systems can write and read 1D and 2D codes on substrate. Moreover, laser is best option to help mark brands and identify components in cost-effective way. Traceability package support logging, board recognition (good/bad) and board processing.

Have Questions? Need a Quote?

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We would be glad to provide a customised solution for you.