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LPKF MultiPress S - PCB Prototyping Machine

LPKF MultiPress S - for reliable bonding of RF multilayers

LPKF MultiPress S presses multilayer circuits from rigid, rigid-flex and flexible PCB materials. Process control provides for a homogeneous material compound with efficient heat dissipation for short cooling phases. The result is an optimum process time.

Features and benefits

Easy-to-Use Press for Standard and RF Multilayers

LPKF MultiPress S evenly distributes pressure across the entire laminating area with precision temperature and pressure process-control, for a uniform material bond. Special process profiles ensure RF materials are securely bonded with efficient heat transmission creating short cool-down periods.

  • Laminates rigid and flexible materials
  • Suitable for RF materials
  • Pre-set and custom process profiles

Custom Process Profiles

Process parameters can be programmed in the LCD display menu and stored as a profile.

Uniform Pressure

The system is available with a manual hand pump or automatic hydraulic control unit.


Download LPKF MultiPress S Brochure

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