Press for Standard and RF Multilayers. Special process profiles ensure reliable bonding of RF materials
The LPKF MultiPress S presses multilayer circuits from rigid, rigid-flex and flexible PCB materials. Process control provides for a homogeneous material compound. Efficient heat dissipation assures short cooling phases. The result is optimum process times.
Easy-to-Use Press for Standard and RF Multilayers
The LPKF MultiPress S laminates multilayer circuits in rigid, flex-rigid and flexible PCB materials. It evenly distributes pressure across the entire laminating area with precision temperature and pressure process-control, for a uniform material bond. Special process profiles ensure RF materials are securely bonded. Efficient heat transmission creates short cool-down periods. The result – optimal process times.
- Laminates rigid and flexible materials
- Suitable for RF materials
- Pre-set and custom process profiles
Custom Process Profiles
Process parameters can be programmed in the LCD display menu and stored as a profile.
Uniform Pressure
The system is available with a manual hand pump or automatic hydraulic control unit.
Please contact us here for a discussion.
We would be glad to hear more about your project!