Precision Repair & Process Control

Toki Automation delivers advanced BGA rework solutions engineered for high-reliability repair and precise thermal management. Our systems are designed for complex assemblies where accuracy, repeatability, and the protection of surrounding heat-sensitive components are critical to saving high-value PCBA.

Our Core Capabilities:

• Precise Component Replacement: We enable the surgical removal and replacement of BGA, QFN, LGA, and CSP packages. Our systems ensure perfect optical alignment and solder joint integrity, even on the highest-density boards.

• Advanced Thermal Profiling: Utilizing multi-zone infrared or hot-air heating, our systems create highly controlled thermal profiles. This prevents common rework defects such as PCB warpage, delamination, or lifted pads.

• BGA Reballing Solutions: We support Advanced Laser Reballing methods. This provides the flexibility to handle various pitch sizes and alloy requirements with minimal thermal stress.

• Large & Complex Board Handling: Our rework platforms are built to stabilize large, heavy-copper, or irregular-shaped PCBs, ensuring uniform heating and precision throughout the entire rework cycle.

From rapid repair to process optimization, Toki Automation focuses on Yield Recovery, ensuring your most complex assemblies are returned to production-grade reliability.