Product Features
- High-precision 3D imaging technology, small angle dual-projection system, further eliminating small spacing occlusion
- 12 million pixel high-resolution industrial camera, HD imaging picture quality, high-speed inspection
- High-precision automatic Z-axis module, which can adapt to various complex processes
- Integrable MES system
- Powerful SPC software, rich and accurate statistics
Types of Detectable Defects
- Irregular Shape
- Excess Solder
- Insufficient Solder
- Solder Short/Bridges
- Offset
- Missed Print
- Missing Copper
- Solder Float
Specifications
| Imaging | 12MP Industrial Camera (21MP Optional) |
| Resolution | 5μm/10μm/15μm |
| Detection Speed | 8.6cm2/s 34.3cm2/s 77.1cm2/s |
| Lighting | RGBW LED |
| Power Supply | 200V - 230V AC, 50/60 Hz |
| Power | 2.2 KW |
| Air Pressure | 0.4 - 0.6 MPa |
| PCB Sizes | 510 x 460 mm |
| PCB Thickness | 0.4 - 6.0 mm |
| PCB Edge Clearance | 3 mm |
| Top and Bottom Board Clearance | 45 mm |
| Transport Height | 900 ± 50mm |
| Measurement Height | Max: 30 mm |
| Statistical Graphs and Reports | Histogram, X bar R/S Chart, Cp/Cpk Display, Reproducibility and Repeatability, Daily/Weekly/Monthly/Annual Yield Rate |
| Auxiliary/ Optional Features | Remote Centralized Review, Barcode Reading |
| Weight | 1300 KG |
| Dimensions | 1100 L x 1350 W x 1630 H mm |