No Clean Solder Wire, 3% Flux, 250g/Spool
Engineered for modern electronics manufacturing, our SAC305 Solder Wire delivers outstanding soldering performance in a lead-free, RoHS-compliant format. Composed of 96.5% Tin (Sn), 3.0% Silver (Ag), and 0.5% Copper (Cu), SAC305 is the industry-preferred alloy for surface-mount and through-hole applications.
This solder wire is pre-loaded with a 3% no-clean rosin-based flux, which ensures fast wetting, excellent joint reliability, and minimal residue — making it ideal for both manual and automated processes. With a melting range of approximately 217–219°C, SAC305 provides smooth, consistent flow and strong mechanical bonds, even under thermal stress.
Key Features:
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Alloy Composition: 96.5% Tin / 3.0% Silver / 0.5% Copper (SAC305)
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Lead-Free & RoHS Compliant
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Flux Content: 3% no-clean rosin-based core ROL1
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Melting Range: 217–219°C
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Available Diameters: 0.3mm, 0.6mm, 0.8mm
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Applications: PCB assembly, SMT rework, consumer electronics, automotive, industrial electronics
Benefits:
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Superior thermal and mechanical fatigue resistance
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High-quality, shiny solder joints with excellent electrical conductivity
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Low spatter, low residue, and fast wetting characteristics
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Suitable for high-reliability applications
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Compatible with a wide range of soldering irons and reflow systems
Whether you're working on critical electronics or high-volume production, SAC305 solder wire with 3% flux delivers the reliability, efficiency, and compliance demanded by today's industries.
Note: Use in a well-ventilated area and follow standard safety practices.