No Clean Paste Flux

No Clean Paste Flux

50g/Jar 
30cc/syringe

Our No Clean Paste Flux is a high-performance, no-clean paste formulated with a blend of premium synthetic resins, rosin, and thickeners. It is specifically designed for precision electronics work and is widely used in the repair of mobile phones, computers, and PCB assemblies. Suitable for screen printing, stencil printing, pad printing, and dot dispensing, it is particularly effective for BGA, Flip Chip, and other high-density interconnect applications.

After reflow, it leaves non-corrosive, non-conductive, and halogen-free residues with excellent insulation resistance, eliminating the need for post-solder cleaning.

View SDS (Syringe) / View SDS (Jar)

View TDS (Syringe) / View TDS (Jar)

✅ Complies with HF / RoHS / REACH standards

Key Features & Advantages

• No-clean formulation: Leaves minimal, safe residue after reflow

• Low-ionic activator system: Ensures high insulation resistance and electrical reliability

• Fast wetting and strong tinning performance

• Excellent reliability: Even in high-density and high-frequency applications

• Non-conductive, non-corrosive residues: Safe for sensitive communication devices

Reheating Instructions

To bring the solder paste to optimal temperature before use, follow these steps:

• Allow the unopened container to thaw naturally at room temperature for approximately 4 hours.

• Do not open the bottle before it is fully thawed.

• Do not heat artificially to accelerate thawing, as this may compromise product performance.

Product Specification