Multilayer Solutions

In-House Production of Up to Eight Layers

Multilayer 

LPKF offers a complete prototyping product line for multilayered Printed Circuit Board (PCB) of up to eight layers in an in-house lab. The LPKF ProtoMat and ProtoLaser models allow for rapid multilayer development. 

Multilayer PCBs

The multilayered PCBs are made up of several layers laminated together to form a PCB, each exhibiting conductive structures. The outer layers of a multilayer typically consist of PCBs structured on one side only; the material of the inner layers is coated on both sides. Insulating layers, so-called prepregs, are inserted between the layers. 

Up to four layers can be through-hole plated in a chemical-free process. For electrical connection of up to eight layers through-hole electroplating is recommended.

They are manufactured in three steps: structuring of the individual layers, laminating, and through-hole plating.

The three basic steps of multilayering

 Structuring

An LPKF ProtoMat circuit board plotter or an LPKF ProtoLaser structures the traces on the base material using the layout data. Supported by automatic tool change and a camera for recording of fiducials, the system accomplishes this layer by layer – nearly automatically.

Laminating

The structured layers are precisely stacked. Between the layers, “prepregs” insulate the traces on the different layers. During lamination, the resin in the prepreg melts due to the high temperature and ensures optimum bonding. A correct laminating pressure and a suitable temperature profile prevent the formation of air pockets. The LPFK MultiPress S hydraulic press performs the task of lamination.

Through-Hole Plating

Through-holes are drilled using the LPKF Proto Mat milling plotter. The LPKF ProConduct is used for the electrical connections – a reliable and particularly conductive paste.

For more than four layers, through-hole electroplating is recommended.

Structuring

LPKF ProtoLaser S4

LPKF ProtoLaser S4

Structure, engrave and cut in a single operation

LPKF ProtoLaser R4

LPKF ProtoLaser R4

Laser ablation with practically no heat transfer

LPKF ProtoLaser U4

LPKF ProtoLaser U4

Compact laser system producing fine, precise structures

Lamination

LPKF MultiPress S

LPKF MultiPress S

Short processing time and sophisticated temperature management

Through-Hole Plating

LPKF ProConduct

LPKF ProConduct

Chemical-free system for lab use

LPKF Contac S4LPKF Contac S4

Classical galvanic process for six layers or more