LPKF Contac S4 - No knowledge of chemistry required
Reliable through-hole plating is a key to success with demanding PCB prototypes. The new LPKF Contac S4 combines various galvanic and chemical processes in a compact safety housing.
- Microvia cleaning step
- Tin option
- Homogeneous copper layer buildup
- Easy operation
Download LPKF Contac S4 Brochure
Features and Benefits
Galvanic Through-hole Plating
Interconnection of two or more layers is an indispensable part of PCB prototyping. The compact LPKF Contac S4 with six baths reliably performs this task: the board is passed through each stage of a bath cascade. This yields reliable copper layers on the surfaces of all existing vias, even in multilayer boards. Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). LPKF Contac S4 offers a subsequent tin bath step for surface protection and improved solderability.
Improved Copper Layer Buildup
LPKF Contac S4 incorporates powerful techniques for improving copper layer buildup. Optimized anode plate and pulse reverse plating ensure homogeneous deposition, and carbon activation using black hole technology, integrated air blow-in, and an additional process step for via cleaning ensure reliable connections to the copper surface without the problem of layer detachment. The result is a homogeneous layer thickness in the holes and on the flat metal surface of the substrate.
Easy to Use
The integrated touch panel with wizard and parameter administration safely guides even inexperienced users through the galvanization process. Ambitious developers can customize the settings at any time. The process requires no knowledge of chemistry and no bath analyses, as the system automatically indicates the necessary maintenance steps. Another new feature is the chemical-resistant housing with improved resistance to discoloration – LPKF Contac S4 combines functionality, good looks, and practicality.