THE FASTER WAY TO CREATE CIRCUIT BOARDS
After the design of the circuit has been imported, the circuit board can be further developed. It involves either mechanical structuring by milling with various ProtoMat systems or laser structuring with ProtoLaser models to manufacture single-sided and double-sided PCBs, multilayers, high-capacity circuits, RF and microwave PCBs, and rigid and flex PCBs.
Copper layers on single- and double-sided circuit boards are selectively removed by mechanical and laser systems to create insulating channels that precisely delineate the required conductive traces and pads. All necessary holes in the board are drilled by circuit board plotters.
How does it work?
Conductive patterns are carved out by the high-speed spindle and milling tools remove the conductive material from the insulating layer. The spindle motor provides low runout which allows for the finest traces and spacing. All traces and solder pads are isolated with the standard milling tool to provide clean and consistent edge geometries.
Milling and drilling tools can be automatically swapped with the installation of the automated tool change onto CircuitPro. This allows for adjustments to the milling width and a more accurate milled pattern.
Laser is best suited for direct structuring of copper-plated PCBs, with its high precision and edge accuracy. The laser beam first creates the trace structure on the surface of the PCB with a precisely dosed energy input, then systematically delaminates/ablates the conductive layer with low energy to avoid damaging the substrate.
For pure ceramic interconnected devices, the laser energy is increased to vaporize the conductive metal layers instead. Laser etching can achieve insulation spacings as small as 15 μm.
It can be used on various substrates such as copper-clad FR4, aluminized PET film, ceramics, duroid or PTFE.
LPKF ProtoMat E44
For cost effective, professional in-house prototyping
LPKF ProtoMat S64
All-rounder for rapid PCB prototyping
LPKF ProtoMat S104
Specialist for RF and microwave applications