Techspray Silicone-Free Heat Sink Compound, thermal grease used to thermally bond a component with a mechanical heat sink.
[This is a pre-order product and will take 8-12 weeks to arrive. Kindly view pre-order FAQs before purchasing.]
Silicone-Free Heat Sink Compound draws heat away when applied to a component.
Also known as thermal grease, thermal paste thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material.
In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.
Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.
FEATURES & BENEFITS - Techspray Silicone-Free Heat Sink Compound
- Thermal conductivity - 0.92 W/m-K
- Functional temperature range -40°F to 392°F (-40°C to 200°C)
- Non-ozone depleting
- Avoid solder defects due to silicon contamination
- Easy application
- Will not separate
- Will not harden and crack
Purchasing in bulk? Speak to our sales here to purchase in larger volumes.