Short Laser Pulses – Nondamaging Material Processing
An important parameter in the laser microprocessing of materials is the pulse width. The LPKF ProtoLaser R4 with picosecond-fast laser pulses allows for extremely precise structuring of delicate substrates and cutting of hardened or fired technical substrates.
Laser Ablation with Practically No Heat Input
In laser technology, the shorter the laser pulse, the lower the heat input into the surrounding material. With a picosecond laser, an important hurdle is over-come: there is practically no heat transfer; the targeted material evaporates immediately.
Specialist for Micromaterial Processing
This thermal effect is important for both the cutting and the surface processing of temperature-sensitive materials. The laser offers a very high pulse energy for cutting, for example, ceramic materials such as Al2O3 or GaN without discoloring the materials in the machin-ing process. Thanks to the low heat input, no micro-cracks arise in the material.
Also for surface processing applications such as ablation of transparent thin films or detachment of metal layers on plastic foils, a very stable laser input at a low laser power is required. The LPKF ProtoLaser R4 can easily straddle these diverging requirements. Standard FR4 and laminated HF materials can be processed just as well with this machine.
Easy to Operate
The high-precision software and the integrated cam-era are supported by the user-friendly LPKF CircuitPro software. This enables the user to complete projects on challenging materials in the in-house lab in a very short time.
- Precision picosecond lasers for innovative research
- Nondamaging processing of heat-sensitive materials
- Intuitive CAM software
- Ready-to-use laser class 1 laboratory system
Please contact us here for a discussion.
We would be glad to hear more about your project!