LPKF Contac S4 - Through-Hole Electroplating


LPKF Contac S4

The LPKF Contac S4 combines various electrolytic and chemical processes in a compact safety housing to provide reliable through-hole plating. It is suitable for the professional manufacturing of PCB prototypes and small batches.

LPKF Through-Hole Plated Layer

Even through-hole plated layers 

Galvanic Through-Hole Plating

The compact LPKF Contac S4 has six baths where the board is passed through each stage of a bath cascade. This yields reliable copper layers on the surfaces of all existing vias, even in multilayer boards. The Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). The LPKF Contac S4 also offers a subsequent tin bath step for surface protection and improved solderability.

Improved Copper Layer Buildup

The LPKF Contac S4 incorporates powerful techniques to improve copper layer buildup, and an additional process step for via cleaning to ensure reliable connections without the problem of layer detachment. The result is a homogeneous layer in the holes and on the flat metal surface of the substrate.

Easy to Use

The integrated touch panel with wizard and parameter administration safely guides even inexperienced users. The process requires no knowledge of chemistry and no bath analyses, as the system automatically indicates the necessary steps.

Another new feature is the chemical-resistant housing – the Contac S4 combines functionality, good looks, and practicality.

Download LPKF Contac S4 Brochure

Back to blog