PCB Depaneling

Depaneling of PCBs for a wide variety of materials

 

Types of Depaneling

Depending on the requirements, depaneling can be performed by either mechanical milling or laser depaneling. The LPKF Protomat and Protolaser machines can be used for depaneling, separating the printed circuit board from the base material. 

An extensive parameter/tool library delivers the settings for the most important materials. The creation of panels is also optimally supported by the LPKF software. 

Mechanical Depaneling

Standard printed circuit board materials like FR4 and FR5 are effectively depaneled using LPFK Protomats' special milling tools. The combination of a vacuum table and optical fiducial detection turns inserting and aligning of a panel into a quick and easy task. The breakout tabs are cut cleanly, providing the user with a PCB with an exact contour. 

Laser Depaneling

The LPKF Protolaser cuts any contour in thin rigid, rigid-flex, or flexible PCB materials. The thermal energy of the laser is used to remove the material path by path/layer by layer. The material is vaporized and the powerful suction system will extract the resulting fumes, resulting in minimal or no residues.

 

LPKF ProtoLasers (Laser Depaneling)

LPKF ProtoLaser S4

LPKF ProtoLaser S4

Structure, engrave and cut in a single operation

LPKF ProtoLaser R4

LPKF ProtoLaser R4

Laser ablation with practically no heat transfer

LPKF ProtoLaser U4

LPKF ProtoLaser U4

Compact laser system producing fine, precise structures

LPKF ProtoLaser ST

LPKF ProtoLaser ST

High performance, table top compact laser for any lab

LPKF ProtoMat (Mechanical Depaneling)

 

LPKF ProtoMat E44

LPKF ProtoMat E44

For cost effective, professional in-house prototyping

LPKF ProtoMat S64

LPKF ProtoMat S64

All-rounder for rapid PCB prototyping

LPKF ProtoMat S104

LPKF ProtoMat S104

Specialist for RF and microwave applications