PRODUCE THOUGH-HOLES AND BLIND VIAS
All holes on a circuit board can be drilled using LPKF's circuit board plotters or LPKF ProtoLasers.
Laser Drilling An efficient technology for producing drilled microvias with diameters of less than 200 μm. The LPKF ProtoLaser can be used to process a range of board substrates, eg. FR4, FR5, RCC, Teflon®, and Thermount®. |
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Mechanical Drilling LPKF CircuitPro automatically converts these drill holes into milling circles. The software also stores drilling parameters thereby preventing additional user intervention. |
LPKF ProtoLasers
ProtoLaser S4 Structure, engrave and cut in a single operation |
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ProtoLaser R4 Laser ablation with practically no heat transfer |
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ProtoLaser U4 Compact laser system producing fine, precise structures |
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ProtoLaser ST High performance, table top compact laser for any lab |
LPKF Circuit Board Plotters (ProtoMat)
ProtoMat E44 For cost effective, professional in-house prototyping |
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ProtoMat S64 All-rounder for rapid PCB prototyping |
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ProtoMat S104 Specialist for RF and microwave applications |