Through-Hole Plating


LPKF Through Hole Plating

After the circuit board is manufactured, it requires through-hole plating, solder mask coating, solder paste printing, assembly and reflow soldering to become a completed electronic assembly.

Two ways of through-hole plating: Chemical-free or Electroplating

1. Chemical-Free: Through-Hole Plating

LPKF ProConduct® is a chemical-free through-hole coating system for double sided and multilayer PCBs with paste. It is suitable for multilayers with up to four layers and a minimum hole diameter of 0.4 mm at an aspect ratio of up to 1:4. At 19 milliohms on average, the electrical resistance of the plated-through holes is extremely low.

Learn more about the LPKF ProConduct here >>

2. Through-Hole Electroplating

Through-hole electroplating uses the LPKF Contac S4 which combines various electrolytic and chemical processes. It is suitable for the professional manufacturing of PCB prototypes and small batches. The system can process multilayers with up to eight layers with a minimum hole diameter of 0.2 mm at an aspect ratio of up to 1:10. 

Learn more about the LPKF Contac S4 here >>

Laser Structuring and Through-Hole Electroplating

LPKF ProConduct

LPKF ProConduct

LPKF Contac S4

LPKF Contac S4

Back to blog